![]() ![]() ![]() ![]() There are other challenges, as well, particularly as die included in those packages become more heterogeneous. One missing bump or a malformed bump will lead to assembly failure and yield loss.” “In some cases, there may be over 5,000 bumps per die. This requires each bump to be the same size and shape to ensure proper assembly downstream. Also, the bump size is continuing to decrease,” said Doug Scott, vice president of wafer services at Amkor. “As I/O pitch within the die continues to decrease, the number of needed bumps per die increases. The denser and smaller the bumps, the more intensive and time-consuming those processes become. Identifying those issues requires a variety of process steps, including various types of inspection and metrology. That can reduce yield if the problem is not identified in packaging, or it can cause reliability problems in the field. ![]() Without co-planarity, surfaces may not properly adhere. Bumps are a key component in many advanced packages, but at nanoscale levels making sure all those bumps have a consistent height is an increasing challenge. ![]()
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